TSMC introduced a 38.1Mb/mm2 SRAM in 2nm-CMOS-nanosheet technology for high-density and energy-efficient compute applications. The design uses a 0.021um2 high-density bitcell, and through DTCO improves the overall SRAM density by 1.1× compared to the previous technology node.
This cell size is the same as N5 and N3E, as well as Intel 18A.
