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Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/threads/intel-foundry-direct-connect-2026.24017/
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2030770
            [XFI] => 1060170
        )

    [wordpress] => /var/www/html
)

Intel Foundry Direct Connect 2026

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XYang2023

Well-known member
Join us on March 24, 2026, for an exclusive opportunity to gain insights from industry technologists, customers, ecosystem partners, and our executive leaders. Gain insights into how our customers and partners collaborate with Intel Foundry, explore cutting-edge process technology, packaging, and test solutions, and delve into the world of resilient supply chains. Get ready to be inspired for the future!

www.intel.com

Intel Foundry Direct Connect – March 24, 2026 – Save the date

Join industry technologists, customers, ecosystem partners, and our own executive leaders as we update on our strategy and process, packaging, and test technologies.
www.intel.com www.intel.com
 
will there be a tape out for a external customer by then? It will be 5 years since IFS was first announced. External revenue is dropping not increasing
 
Daniel Nenni said:
TSMC will not package other foundry die so Meta is all TSMC.
Click to expand...
But in this potential example, it would be using TSMC wafers ... and then use Intel packaging. (not using TSMC CoWoS packaging that included Intel silicon)

Intel has had a number of examples where they used TSMC silicon -- but used Intel packaging. (as far as I know) So that must be an option.
 
ChrisGar said:
But in this potential example, it would be using TSMC wafers ... and then use Intel packaging. (not using TSMC CoWoS packaging that included Intel silicon)

Intel has had a number of examples where they used TSMC silicon -- but used Intel packaging. (as far as I know) So that must be an option.
Click to expand...

Definitely. It says a lot about Intel packaging and will be an excellent benchmark between the two.
 
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