No they will, if the mask size can fit, because High NA EUV mask can produce a chip that is in max 1/2 size of Low NA EUV. So if the Mask size can fit then it is High NA EUV, we are not 100% sure i.e. stitching
ASML is production rate is around 12 p.a. High NA Machine is not assembly in Europe, but whether the location of the installer, in Intel case that is USA. Take a gain of salt from ASML, and let say there is 8 machine that ASML produce per year, and half of them is allocated to Intel, that is around the level that 4 per year, so that by 2028 Intel with the initial 2025 allocation (2 added) should have at least 10 if not even more by Q4 2027. So I don't need to change my forecast, when I did a bit of research even using AI only, Google AI shows me that 12 p.a. 50-60% to Intel ongoing, my forecast is rough but is still sounded.
In the main time, the research machine and whether they slowly install should address the required for initial tape out, using the shape of Clearwater Forest and/or Panther Lake, they might be using that to do an initial testing tape out already. This is the advantage of internal fab, they can do an High NA EUV run and still get a working chip and sell it as it is, no one know / care that the chip was made using High NA or not, they can ramp the new machine quickly and master the stitching process.
My forecast on TSMC timeline is around 2035, so this is that bad, is just like a Boeing / Airbus, you needed to pay to get a slot, even you think that slot is very expensive, at the end, TSMC is running B747/A340 but your competitor is running B787/B777/A350, the economic will not work out. Even if A14 is on Low NA, if I am CC Wei, I will now buy a slot, since even I pay now for the slot, it will only be available in 2032 at best