Analyzing electrical errors across an IP or a SoC at top level, can be a painful and long process, often requiring extensive setup time and hundred of hours to distinguish …
Electronic components design and their integration on PCBs involve complex simulations to accurately predict EM fields and forces. These simulations can be computationally intensive and time-consuming. High-performance computing (HPC) capability …
Continue reading "Webinar: Speed Up Your Electronic Component Design with HPC"
Ensuring reliable performance of products in the field requires verification and validation at the system level. This means considering the complex interaction of different physics between systems and sub-systems. In …
Whether you’re conducting safety analyses at the system, software, or hardware level, medini analyze can help you achieve: Up to 50% increased efficiency in your functional safety analyses, End-to-end traceability, including integration …
Continue reading "ISO 26262 Safety Analysis: Streamline Your Path to Functional Safety"
Description Today’s wireless and high-speed chip designs integrate an incredible amount of functionality on very small silicon real estate. Such integration requires optimization from the early stages of the design …
Continue reading "Webinar: Chip-Level Electromagnetic Crosstalk Signoff Using EMX Solver"
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
The digital chip design flow carries with it an enormous wealth of untapped information regarding the health and status of your SoC design. The ability to efficiently mine this data …
Continue reading "Webinar: Maximize Productivity with Deep Insights into PPA Trajectories"
This webinar equips you with effective strategies to tackle randomization-related errors within your UVM verification environment. We'll explore the power of Cadence's Verisium Debug, a tool designed to simplify the …
Continue reading "Webinar: Efficient Way to UVM Constraint Randomization Debug"
Leveraging functional patterns is crucial for achieving high defect coverage and reducing defective parts per million (DPPM) levels. Synopsys VC Z01X fault simulator offers enhanced fault coverage in manufacturing test flows, complementing …
Continue reading "Webinar: Enhancing Manufacturing Test Flows with Synopsys VC Z01X"
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, …
Continue reading "Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update"
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
The challenges before semiconductor fabs are expansive and evolving. As the size of chips shrinks from nanometers to eventually angstroms, the complexity of the manufacturing process increases in response. To …
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
Learn how you can improve the accuracy of your simulations with high-quality, consistent materials and data information that are seamlessly available within your simulation tools in this upcoming webinar. TIME: …
Continue reading "Ansys 2024 R2: Enhancing Simulation Accuracy with Materials Intelligence"
