Wafer-Level Packaging Symposium 2026
Hyatt Regency San Francisco Airport 1333 Bayshore Highway, Burlingame, CA, United StatesFormatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …