• IEEE Hybrid Bonding Symposium

    SEMI HQ SEMI HQ, 673 S Milpitas Blvd., Milpitas, CA, United States

    January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx. Download the Call for Presentations! Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device …

  • ESDA Webinar—When Devices Become Weapons: A Closer Look at the Pager Attacks

    Online

    On October 17-18, 2024, Israel launched a deadly attack on Hezbollah in Lebanon and Syria using tampered pager and walkie-talkie devices, nicknamed “Operation Grim Beeper.” The exploding pager attack illustrates the vulnerability of the electronics supply chain to a dedicated nation-state adversary. We will explain how the supply was compromised and focus specifically on the …

  • FLEX 2026 – Technology Summit

    The WIGWAM The Wigwam, 300 E Wigwam Blvd, Litchfield Park, AZ, United States

    FLEX 2026 | TECHNOLOGY SUMMIT | FEBRUARY 24-26, 2026 THE WIGWAM ARIZONA RESORT | PHOENIX, AZ A 25th Anniversary Celebration Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ. FLEX—Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge …