Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These …
