THE CONFERENCE The first European Solid-State Device Research Conference (ESSDERC) conference was organized in 1971 in Munich, Germany, aiming to present the latest developments in physics, technology and characterization of …
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Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart systems. Learn how these technologies are driving Europe’s leadership in the sensor revolution while shaping a more intelligent, interconnected future. Join us in to Sensing …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
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Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between the two …
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