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Tum City Center Campus
Tum City Center Campus, Arcisstraße 21, Munich, Germany
THE CONFERENCE The first European Solid-State Device Research Conference (ESSDERC) conference was organized in 1971 in Munich, Germany, aiming to present the latest developments in physics, technology and characterization of solid-state devices and bringing together both the academic world and the industry active on silicon and compound semiconductor integrated circuits. In 1975, the initiative was …
ICM – International Congress Center Messe München
Messe München GmbH, Messegelände, München, Germany
Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart systems. Learn how these technologies are driving Europe’s leadership in the sensor revolution while shaping a more intelligent, interconnected future. Join us in to Sensing …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar …
