100 YEARS of FETs: SHAPING the FUTURE of DEVICE INNOVATIONS Inside IEEE IEDM 2025 Focus Sessions Focus Session #1 - Efficient AI Solutions: Architecture, Circuit, and 3D Integration Innovations for …
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January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx. Download the Call for Presentations! Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. What’s New Download the ISSCC 2026 …
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New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing …
