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Empowering Europe's Semiconductor Future: Innovation, Integration & Independence Renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the …
Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25, Building 17/3, Berlin, Germany
On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar …