ESSERC 2025 – 51st IEEE European Solid-State Electronics Research Conference

Tum City Center Campus Tum City Center Campus, ​Arcisstraße 21, Munich, Germany

THE CONFERENCE The first European Solid-State Device Research Conference (ESSDERC) conference was organized in 1971 in Munich, Germany, aiming to present the latest developments in physics, technology and characterization of …

Electronic Packaging Days 2025

On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration …

MEMS & Imaging Sensors Summit 2025

Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart systems. Learn how these technologies are driving Europe’s leadership in the sensor revolution while shaping a more intelligent, interconnected future. Join us in to Sensing …

embedded world 2026

Exhibition Centre Nuremberg Exhibition Centre Nuremberg, Messezentrum 1, Nürnberg, Germany

Global platform for the embedded community The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and …