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In this webinar, Intel will present how EMIB-T (Embedded Multi-die Interconnect Bridge with TSVs) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share a production-oriented EMIB-T reference methodology built on Synopsys' 3DIC Compiler platform that spans early planning through signoff. The webinar highlights how early bump … |
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