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Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 … |
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Plan today to attend and participate at ISTFA 2025! Join us for the 51st International Symposium for Testing and Failure Analysis (ISTFA) is set to take place in Pasadena, California, from November 16-20, 2025. As the premier event for the microelectronics failure analysis community, ISTFA brings together leading experts, industry professionals, and researchers to share … |
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December 2, 2025 - 11:00 AM EST December 3, 2025 – 10:00 AM JST/KST Discover the 5 Critical Advanced Packaging Market Trends Reshaping Semiconductors in 2026 AI, 3D stacking, and next-gen substrates—what’s next for advanced packaging. The advanced packaging industry is at the forefront of semiconductor innovation, driven by the explosive growth of AI and … Continue reading "Webinar: 5 Expectations for the Advanced Packaging Market in 2026" |
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