Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
As businesses demand more from their cloud infrastructure, balancing performance, cost, and scalability is more critical than ever. In this webinar, experts from Google Cloud and Arm will break down the benefits of Google Axion Processors—Google’s first custom Arm-based CPU designed for datacenters—and explain why industry leaders like Spotify are adopting them for superior price-performance. Gain insights into the underlying Arm Neoverse architecture, explore real-world …
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Featured Speakers: Jyotika Athavale, Director, Engineering Architecture, Synopsys Yervant Zorian, Chief Architect & Fellow, Synopsys Abstract: Advancements in data center and automotive System-on-Chips (SoCs) to meet AI workload demands have resulted in the increased adoption of emerging technology nodes and chiplet packages. This presentation will explore the resiliency challenges faced by these critical systems. Additionally, …
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Join David MacQueen and James Sanders as they explore Intel’s bold strategies to regain dominance in the semiconductor industry. With increasing competition from AMD and TSMC, Intel faces significant challenges in its bid to reclaim leadership. This webinar will provide expert insights into the market forces shaping Intel’s comeback, its manufacturing roadmap, and the impact …
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Software Defines Everything For today’s SoC and system designs, hardware is designed and optimized for the software workload. Workloads can include firmware, multi-OS architectures, AI/ML and complex graphics. These combined produce large software models that put pressure on system-level verification. What is the Arm Compute Subsystem (CSS) A compute subsystem is a pre-integrated, optimized …
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VOICE is a developer conference, created by test engineers for test engineers. Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world's leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements, express new ideas, share best …
The RISC-V Summit Europe is the premier event that connects the European movers and shakers – from industry, government, research, academia and ecosystem support – that are building the future of innovation on RISC-V. RISC-V, the open standard instruction set architecture (ISA), is enabling a range of new applications and research that will define the future of computing …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
Join us in Munich where peer-delivered technical sessions will be shared across a breadth of topics so you can explore new concepts or dive deep in your core area of expertise with fellow like-minded professionals. Munich, Germany | May 13, 2025 Registration opens Feb. 10, 2025. About User2User The User2User conference is your opportunity to …
Join us at Europe's largest quantum event We look forward to seeing you in 2025 where we will welcome 1,000 attendees from 40+ countries! At Commercialising Quantum Global, our case study-led agenda sets the stage for vital discussions on how organisations should prepare for and implement quantum technology. We provide an accessible and in-depth debate …
The major annual event of the Israeli semiconductor industry ChipEx2025, the largest annual event of the Israeli semiconductor industry, will be held on May 13-14, 2025 in Tel Aviv, Israel. ChipEx2025 showcases companies including manufacturers, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world's leading experts address the industry's most relevant …
Semiconductor Industry Market Forecast - Slide Deck & Video Link Now Available Presented Via Zoom, 14 Jan 2025 3-4pm UK (BST, GMT+1) Mark your diary now - IFS Industry Update Webinar 13 May 2025 The insights we have presented at our previous IFS events have consistently proved right. Has the chip market finally started its …
Industry Update Webinar - 13 May 2025 Presented Via Zoom, 3pm-4pm UK BST (UMC/GMT+1) Registration Open Now! Has the chip market finally started its broader industry recovery? How much longer will the AI-infrastructure boom last? What will be the likely impact of Donald Trump’s global tariff vendetta? What fate now awaits the industry in 2025? …
Learn to teach antenna design effectively with PyAEDT. This webinar covers scripting, HFSS, Maxwell, Icepak examples, and advanced simulations for professors. TIME: 05/14/2025 11 AM EDT Venue: Virtual Overview Today’s engineering practice requires skills in scripting, finite element analysis of designs, and a combination of both. By teaching this combination, you can engage your antenna …
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Get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded …
Be part of the largest independent, international conference dedicated exclusively to engineering simulation. Discover new technologies & innovative techniques, whilst networking with end-users, software vendors, consultants and academics, in this worldwide celebration of simulation. Immerse yourself in the world of simulation, present your work, learn from others, and forge lasting professional relationships with your peers in the modelling and …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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Join us for the User2User North America event, which is a dedicated environment for exchanging ideas, information, and best practices that enable you to lead in your role and achieve success with your customers. Santa Clara, CA | Santa Clara Marriott May 20, 2025 Registration opens Feb. 10, 2025. About User2User The User2User event is …
Founded in 2011, the Edge AI and Vision Alliance is a worldwide industry partnership that brings together technology providers who are enabling innovative and practical applications for edge AI and computer vision. Its nearly 100 Member companies include suppliers of processors, sensors, software and services. The mission of the Alliance is to accelerate the adoption of edge AI …
Featured Speakers: Dr. Falco Munsche, Technical Product Marketing, Synopsys Junsu Heo, SoC Design Lab, Konkuk University, Korea Learn about: Synopsys ASIP Designer, the industry-leading tool to explore, design and optimize application-specific processors ASIP design methodology to address challenges in modern wireless communication systems Several ASIP designs crafted with the tool, including ASIPs for FFT, channel …
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Date: May 21, 2025 | 10:00 AM PDT Featured Speakers: Nitin Navale, Principal Member of Technical Staff, AMD Amlendu Choubey, Sr. Director, Product Management, Synopsys Why You Should Attend: With the rising demand for highly efficient 3DIC design and performance, it’s crucial to understand the IR and thermal landscape of a product as early as possible in the design …
Webinar Content Dive into the world of evaluating Large Language Model (LLM) agents with a focus on practical insights and actionable strategies. This webinar will cover key evaluation metrics and methodologies to assess the performance, reliability, and effectiveness of LLM agents in diverse applications. Gain a comprehensive understanding of how to design evaluation frameworks that …
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Join the ESD Alliance for an informative evening of networking, presentations, and a panel! Time 5:30 pm - 8:30 pm PDT How Multi-Physics is Reshaping Chip Design and EDA Tools Increasing system complexity and shrinking semiconductor devices are changing the chip design landscape. Traditional single-domain analyses are no longer sufficient to ensure a successful product. …
The 30th IEEE European Test Symposium (ETS) is Europe's premier forum dedicated to presenting and discussing scientific results, emerging ideas, hot topics and new trends, as well as industrial case-studies and applications in the area of electronic-based circuits and systems testing, reliability, safety, security and validation. This year we will celebrate the anniversary 30th edition of ETS! …
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About ECTC The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. The technical program contains papers covering leading edge developments …
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Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
