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Don't miss our upcoming webinar, where we'll explore the importance of safety in automotive design. This session will focus on the customer's high demand for integrated safety flows in verification, digital, and analog design. We'll showcase the exceptional value of the Midas Safety Platform for engineers designing automotive safety applications, and how it seamlessly integrates …
Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …
Fresh New Name. Same Great Event. Introducing MD&M West Previously known as Informa Markets Engineering (IME) West, hosting five co-located shows — MD&M West, ATX West, D&M West, Plastec West, and WestPack — we are now merging 4 of these related industry sectors into a single unified show: MD&M West. WestPack, well-known as the leading …
Join Comer Industries and Asotech in this webinar to see how Ansys simulations optimize gearbox durability and performance. DATE / TIME: February 4, 2025 10 AM EST / 4 PM CET / 8:30 PM IST Overview This webinar will delve into how Comer Industries, with the support of Asotech, leverages Ansys simulations to ensure the …
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …
Historically, PCB power distribution networks (PDNs) have been designed based on rules of thumb, such as “put a 0.1uF decoupling cap down for every power pin on the device”. These can lead to more capacitors than necessary, taking up additional space in the layout and driving up cost of the final assembly. In addition, they …
Creating custom blocks in Virtuoso using today's advanced technology nodes becomes even more complex due to the vast number of design rules. Invoking a typical GUI to launch multiple DRC runs to confirm your progress and understanding of these complex rules can be very time consuming. Join this webinar to learn how to use iPegasus …
About this event Modern devices' growing complexity and the semiconductor industry's domain-specific nature have made intellectual property (IP) management essential. This webinar explores how Allegro Microsystems, a global leader in designing, developing, and manufacturing sensor integrated circuits (ICs) and application-specific analog power ICs, leveraged IP management to streamline innovation and efficiency. It delves into the …
About this event Thank you to our sponsors, Synopsys and Cadence The Trends in System Design event, hosted by DESN in Reading on February 6th, will be open to both members and non-members. We will examine emerging trends in semiconductor system design, with a particular focus on how AI/ML is being used in product design …
Cutting Edge Advancements in 5G and 6G Technology Join us for a complimentary seminar and networking event on the latest advanced 5G and 6G technology! Our experts will provide updates on global spectrum regulation, 6G standardization, channel modeling for FR3, and sub-THz research. Explore the use of AI and ML in 6G research and its …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Why You Should Attend Optimizing power is no longer optional—it's critical for advanced designs. This seminar will provide cutting-edge insights and practical methodologies to: Design efficient, low-power architectures Accurately analyze and optimize power at every stage of the design flow Seamlessly implement power optimization into your design workflows What You Will Learn Architecting for Low …
Parasitic extraction is a crucial step during the design implementation and signoff phase. Accurate reporting of parasitic Rs and Cs in a layout has always been a challenge as DSPF file format traditionally used for this purpose, is often limiting in terms of interactivity and efficiency. Join our webinar to learn about revolutionary tool Quantus …
Join us on February 13th for an in-depth look into how optical sensors are revolutionizing health monitoring in wearable devices, offering unprecedented accuracy and functionality for real-time physiological assessments. TIME: February 13th, 2025 Session One: 9:00am EST Session Two: 2:00pm EST Venue: Virtual Overview Join us for an in-depth look into how optical sensors are revolutionizing …
Join this webinar to explore the potential of Computational Fluid Dynamics (CFD), supported by AI/ML, to optimize and troubleshoot fluid-handling equipment and plant. Date: Thursday, February 13, 2025 Time: 15:00 GMT | 16:00 CET | 10:00 EST Venue: Online Questions Should you have any questions please contact uk-marketing@ansys.com About this webinar CFD simulation provides detailed insight …
The automotive sector is transitioning to software-defined vehicles, focusing on unified compute solutions for central processing, zonal architectures, in-cabin sensing, and digital cockpits. With AI/ML enhancing vehicle functionalities, cars are becoming akin to mobile devices, especially as we advance towards autonomous driving requiring numerous sensors like Vision/Radar/Lidar. This evolution necessitates high-performance compute and interface IPs; …
Join Us for Ultra-Low-Power and Advanced Design Explore the future of systems at CadenceCONNECT: Design the Future of Systems Together. This ultra-low- power and advanced design seminar dives into the critical methodologies and technologies you need to tackle low-power design challenges while achieving performance, area, and time-to-market goals. Why You Should Attend Optimizing power is no …
About the HPA Tech Retreat: The HPA Tech Retreat is unique among entertainment industry events, where world-class leaders in engineering, technology, creativity, and business step away from their daily routines to explore and experience the most compelling topics in content creation, management, and dissemination. This exclusive gathering fosters authentic discussions among experts, offering insights and …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. REGISTER HERE
About this event The NATE UNITE Annual Exposition & Conference is the only event in the United States to focus on communications infrastructure contractors, and the products, services, and technologies that are transforming the way we work and live. NATE UNITE’s emphasis on education, training, and safety standards is unrivaled. As a result, NATE UNITE …
Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for their active engagement throughout the symposium! The WLPS showcased a rich and diverse technical program, featuring cutting-edge presentations and discussions on semiconductor and packaging technologies. …
Products evolve over time and often need to meet new and unexpected use cases and requirements. Register for this webinar and learn how to select the best materials to overcome engineering challenges and meet demanding customer requirements. TIME: February 18, 2025 11 AM EST / 5 PM CET / 9:30 PM IST Overview The optimal …
FPGA Front Runner - Using AI in development and product for FPGA How are they used? What input language is used and how does it find it’s way into the FPGA? How is the AI trained? Any use case example Partner FPGA Front Runner event Partner: TechWorks & Tessolve NOTE Please be aware that if you register for …
Beginning with 189 booths in 1987, SEMICON Korea has established itself as an exhibition representing the semiconductor industry thanks to the continuous growth of the Korean semiconductor industry. SEMICON Korea 2025 is scheduled to be held from February 19 to February 21, 2025. This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …
Discover how Ansys tools like Twin Builder ROM streamline LS-DYNA crash simulations, optimize workflows, and accelerate robust system development. TIME: February 19, 2025 11 AM ET Overview Crash simulations in LS-Dyna are essential for analyzing complex scenarios involving various physical models Fine mesh models are often used to achieve accurate results, significantly increasing computational demands. …
Properly constraining your design is a must whether designing for high-speed, high-voltage, or high-density. Electrical Constraints in OrCAD X give designers the tools to control routing based on impedance and timing requirements, allowing users to analyze and tune those signals and reuse information between designs. Join us in this webinar as we explore Electrical Constraints …
Be a part of the largest annual simulation conference in the Bay Area. We have sponsorship packages for exhibitors and speaker opportunities available. Reach out for more information. his one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, …
On February 20, 2025 in Cairo, Egypt, we are hosting the GSA MENA Executive Summit to look beyond the current divisions and rather recognize the Middle East North Africa regional potential as a source of capital and destination for innovative tech developments. This semiconductor and tech-focused exec forum will take place in a stunning brand-new venue: the Grand …
Join this webinar to explore the potential of 3D Particle Dynamics Discrete Element Method (DEM) simulation, supported by AI/ML, to optimize and troubleshoot particle processing equipment and systems in chemical processing. Date: Thursday, February 20, 2025 Time: 15:00 GMT | 16:00 CET | 10:00 EST Venue: Online Questions Should you have any questions, please contact uk-marketing@ansys.com About …
Microsoft Focus on IP QA with Solido IP Validation Suite As System-on-Chip (SoC) designs grow increasingly complex, design IPs have become essential building blocks, promoting modularization and reusability. However, ensuring quality across vast IP libraries with diverse formats and views presents a significant challenge. Inconsistencies such as mismatched data between logical and physical views, missing …
Attend to hear research, challenges, and breakthroughs as you gather with colleagues in San Jose Join other leading researchers who are solving challenges in optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications. REGISTER HERE
The Identity and Payment Summit will bring together leaders from the payments, identity and access communities to tackle industry challenges head-on, share first hand how those challenges impact each stakeholder, and provide a platform for all parties to learn and benefit from a more robust ecosystem. Together, we can not just address issues, we can …
DVCON U.S. 2025 The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies and standards for the design and verification of electronic systems and integrated circuits. The focus of this highly technical conference is on the practical aspects of these technologies and their use in leading-edge projects …
The average age of operating nuclear reactors worldwide, measured from their grid connection, is 31 years. The U.S. and France operate some of the oldest fleets, with average reactor ages of 41 and 36 years, respectively. In this webinar, you will understand the critical role of simulation in supporting nuclear plants' lifespan extension and how …
The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren't just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components that can be mixed, matched, and scaled to create powerful, electronic systems …
A “PCB thermal analysis” design activity has traditionally involved the PCB designer transferring a finished design to a dedicated thermal analysis tool. While this has indeed successfully contributed to numerous PCB thermal signoffs in the past, there are inefficiencies that can be mitigated with the use of Cadence’s Allegro X Design Platform for PCBs and …
