About DISTRIBUTECH® is the largest, most influential transmission and distribution event in the country, now expanding with focused events on Data Centers & AI, the Midwest, and the Northeast to best support a dynamic industry. DISTRIBUTECH's® flagship event offers a wealth of education, connections, and solutions that drive the industry forward through the conference program …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
About Us For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and …
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The 2025 OFC Conference and Exhibition Explore the Thriving and Ever-Expanding Optical Communications and Networking Industry - Register Now The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications. With over 13,500 expected registrants from 83+ countries, a showcase of more than 600 exhibiting global companies, and hundreds of …
DATE 2025 offers numerous opportunities to get in contact with the DATE community and to advertise their novel solutions. Download the DATE 2025 Promotion & Sponsorship Opportunities here DATE 2025 is the perfect opportunity to present and communicate your technological and business capabilities to scientific, industrial and commercial audiences at one single European event. All companies, institutions, universities, initiatives …
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SHAPING THE FUTURE WITH TECHNOLOGY At the world’s leading industrial trade fair, companies from the mechanical engineering, electrical engineering and digital industries as well as the energy sector will come together to present solutions for a high-performance, but also sustainable industry. More than 4,000 companies will be acting as an interconnected industrial ecosystem and demonstrating …
INAUGURAL EVENT FOCUSED ON SMART MANUFACTURING & SMART MOBILITY DRIVING SEMICONDUCTOR BUSINESS IN THE MIDWEST Join us for a groundbreaking Midwest conference and tradeshow on April 1-2, 2025, focused on Smart Manufacturing and Smart Mobility with an emphasis on the semiconductor industry! Automotive electronics and smart manufacturing are two of the key end markets on …
About Us Now in its 18th year, the IEW continues to provide a relaxed, invigorating atmosphere to present new work and engage in discussions about the latest issues confronting the ESD and EOS communities. In 2025 IEW-US will again co-locate with the International Reliability Physics Symposium (IRPS). In addition to everything IEW-US provides, IEW-US registrants …
This bootcamp guides you through the design of superconducting qubits and quantum amplifiers with product demonstrations to illustrate the concepts you can apply in your design flow today. By the end of this bootcamp, you will have a pathway toward realizing robust and scalable superconducting quantum chips, accelerating progress in quantum computing and quantum information …
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An infrastructure to enable debug and trace for your RISC-V systems is essential to identifying root-causing bugs. In this presentation, we will give an overview of Tessent UltraSight-V, an end-to-end RISC-V debug and trace solution consisting of embedded IPs and software that integrate with industry-standard tools. We will explain how the integration of UltraSight-V’s on-chip …
Empowering Engineers to Electric Machine Design This in-person technical conference will focus on the latest technological advancements in electric machine development. A range of speakers from the industry will discuss their challenges and approaches in this area. In the presentations and workshops, you will learn about technology updates and hear from prominent automotive companies about …
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The ever-evolving landscape of semiconductor design demands robust ESD protection strategies that balance performance, reliability, and compliance. At the 2025 International Electrostatic Discharge Workshop (US-IEW), industry leaders will come together to tackle two of the most pressing topics in ESD: Foundry ESD Checks and IC Requirements and Standardized ESD Compact Models. We’re excited to announce that Stephen Fairbanks, CEO and …
About Bio-IT World Conference & Expo Bio-IT World Conference & Expo is the premier global event showcasing technologies and analytic approaches that solve problems, accelerate science, and drive the future of precision medicine. By uniting a community of experts in life sciences, pharmaceuticals, clinical research, healthcare, informatics, and technology, the event pushes the boundaries of …
Learn about the revolutionary AI-driven electromagnetic-aware methodology of Ansys that automates the optimization of the floor plan of analog and RF physical layouts. DATE / TIME: April 2, 2025 9 AM EDT / 3 PM CEST Overview Analog/RF IC design has been traditionally considered an art – sometimes even a “black art” – because, contrary …
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Learn about the revolutionary AI-driven electromagnetic-aware methodology of Ansys that automates the optimization of the floor plan of analog and RF physical layouts. DATE / TIME: April 2, 2025 9 AM EDT / 3 PM CEST Venue: Virtual Overview Analog/RF IC design has been traditionally considered an art – sometimes even a “black art” – …
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About this event This webinar will guide you through a modernized design process, covering everything to ensure a more comprehensive and accurate design. This includes: Modeling transistors and creating schematics to perform transient simulations. Performing electromagnetic simulations to account for parasitic effects. Introducing post-layout simulation to help reduce the need for multiple design spins and …
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Semiconductor packaging is a critical step in the development of modern electronic devices, influencing their performance, reliability, and thermal management. The complexity of packaging technologies has grown significantly with the demand for miniaturization, higher power densities, and improved mechanical and thermal robustness. Addressing these challenges requires a comprehensive understanding of the multiphysics interactions within semiconductor …
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