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November 4, 2025 | 10:00 AM PST This webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that …
New York University Tandon School of Engineering
New York University Tandon School of Engineering, 6 MetroTech Center, Brooklyn, NY, United States
What is the Brooklyn 6G Summit The Brooklyn 6G Summit (B6GS) is a premier event for the global communications industry, bringing together leading voices from technology, business, academia and regulation to shape the future of wireless. Jointly organized by Nokia and the NYU WIRELESS research center at the NYU Tandon School of Engineering, the Summit …
Details Imaging radar has rapidly evolved into a critical technology for autonomous systems, with patent activity accelerating significantly over the past decade. From 2015 to 2024, global imaging radar patent publications increased more than tenfold, fueled by the rise of autonomous driving, 4D radar integration, AI-based perception, and sensor fusion. This surge has created an …
High-Level Synthesis (HLS) is design flow in which design intent is described at a higher level of abstraction such as SystemC/C++/Matlab/etc. HLS tools are expected to synthesize this code to RTL which can be input to the traditional RTL downstream flow (RTL/GDS). Formal check tools are difficult to be analyzed on generated RTL (as the …
Keysight Technologies
5301 Stevens Creek Blvd., Santa Clara, CA, United States
Power testing is more complex than ever. From subtle low-power signals to multi-kilowatt loads, bulky setups and limited software often slow you down and take up valuable lab space. At Open Lab Day: Power Without Compromise, you’ll experience what’s next in power testing: faster validation, greater accuracy, and more capability in less space. Keysight’s newest power …
About this event Join Roger Nichols, 6G Program Manager, for an insightful discussion on the 6G spectrum. He will cover the current status of 6G technologies, standards, and policies for the next generation of wireless, including developments from 2024 after the World Radio Conference. Who should attend this event? This webinar is for 6G researchers …
Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided …
November 5, 2025 - 11:00 AM EST November 6, 2025 – 10:00 AM JST/KST Discover the 5 Critical Sensor Market Trends Reshaping Semiconductors in 2026 From 8K smartphones to AI at the edge—explore the next generation of image sensor innovation. The image sensor industry is shifting from traditional pixel scaling to functionality-driven differentiation, unlocking new …
Join our webinar to learn how Ansys optiSLang and Thermal Desktop tackle thermal and fluid challenges, optimize design, and enhance product performance with a vapor chamber use case. Date & …
Join our webinar to explore how Ansys LS-DYNA enhances manufacturing simulations in sheet metal forming, welding, forging, and more, improving accuracy and workflow efficiency. Date/Time: November 5, 2025 11 AM IST …
Computer History Museum
Computer History Museum, 1401 N Shoreline Blvd, Mountain View, CA, United States
On-the-Road to a $1 Trillion Industry Reaching $1 trillion in annual semiconductor sales by 2030 presents both significant challenges and offers compelling opportunities. About this event Reaching $1 trillion in annual semiconductor sales by 2030 presents both significant challenges and offers compelling opportunities. Demand is accelerating, driven by AI, automotive, data centers, and IoT - …
Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25, Building 17/3, Berlin, Germany
On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration …