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Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, …
Scaling Together in a Dynamic World The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges for high-speed, energy-efficient solutions, the question isn’t if photonic chips will revolutionise industries, but how fast we can make it happen. At PIC Summit Europe 2025, we …
Connect to the embedded community With its 20 years of history and experience in Europe, embedded world is the most professional and largest exhibition in its field, and has accumulated …
November 4, 2025 | 10:00 AM PST This webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that …
What is the Brooklyn 6G Summit The Brooklyn 6G Summit (B6GS) is a premier event for the global communications industry, bringing together leading voices from technology, business, academia and regulation …
Details Imaging radar has rapidly evolved into a critical technology for autonomous systems, with patent activity accelerating significantly over the past decade. From 2015 to 2024, global imaging radar patent …
High-Level Synthesis (HLS) is design flow in which design intent is described at a higher level of abstraction such as SystemC/C++/Matlab/etc. HLS tools are expected to synthesize this code to …
Power testing is more complex than ever. From subtle low-power signals to multi-kilowatt loads, bulky setups and limited software often slow you down and take up valuable lab space. At Open …
About this event Join Roger Nichols, 6G Program Manager, for an insightful discussion on the 6G spectrum. He will cover the current status of 6G technologies, standards, and policies for …
Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided …
November 5, 2025 - 11:00 AM EST November 6, 2025 – 10:00 AM JST/KST Discover the 5 Critical Sensor Market Trends Reshaping Semiconductors in 2026 From 8K smartphones to AI at the edge—explore the next generation of image sensor innovation. The image sensor industry is shifting from traditional pixel scaling to functionality-driven differentiation, unlocking new …
Join our webinar to learn how Ansys optiSLang and Thermal Desktop tackle thermal and fluid challenges, optimize design, and enhance product performance with a vapor chamber use case. Date & Time: November 5, 2025 11AM EDT Venue: Virtual Overview In this webinar, discover how Ansys optiSLang and Ansys Thermal Desktop empower engineers to tackle complex …