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About this event Be the first to see brand new, Keysight-commissioned research on Cybersecurity Maturity Model Certification (CMMC) readiness across the U.S. Defense Industrial Base. In this live webinar, we’ll unveil findings from hundreds of security, IT, and compliance leaders and show where organizations really stand. Plus, attendees will be the first to get the full research paper, The Power of …
SEMI HQ
SEMI HQ, 673 S Milpitas Blvd., Milpitas, CA, United States
January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx. Download the Call for Presentations! Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device …
San Francisco, CA
San Francisco, CA, United States
About this event Stay connected with the latest optical design product innovations across CODE V, LightTools, RSoft, ImSym, and our optical scattering measurement solutions. Get tips and tricks on design best practices from our experts, and network with industry peers and the Keysight Optical Design Engineering team. The user conference is held in parallel with …
NIST's National Cybersecurity Center of Excellence (NCCoE)
9700 Great Seneca Highway, Rockville, MD, United States
The National Institute of Standards and Technology (NIST) will host the Semiconductor Traceability and Provenance Workshop on Tuesday, January 27, 2026, at the NIST National Cybersecurity Center of Excellence (NCCoE) conference facility, in Rockville, Maryland. This in-person, one-day event builds on the momentum from the April 2025 workshop on Trust and Provenance in the Semiconductor Supply Chain, …
Timing closure is one of the most challenging aspects of ASIC design. While traditionally seen as a backend process, its resolution begins at the architectural level and extends through the implementation stages. This webinar examines the key obstacles designers encounter and demonstrates how our timing closure solutions deliver comprehensive support throughout the entire design process. …
In this webinar, we will explore the growing threat that AI-fueled cyberattacks pose to chip designs and how to add expert-level security verification to your design flow to minimize those risks. We will expose some of the details of the existential risk for electronic systems with real examples. We will then describe technology that easily …
Intro The Compact-Q DEER Spectrometer is designed to support researchers in academia and industry to efficiently characterize quantum materials, develop devices for quantum sensing, advance and validate algorithms to control qubits, and other applications in spin-based quantum technologies. The Compact-Q DEER system features a modern microwave architecture, high-resolution AWG, and digital signal processing schemes enabling …
San Francisco Marriott Marquis
San Francisco Marriott Marquis, 780 Mission Street, San Francisco, CA, United States
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. What’s New Download the ISSCC 2026 …
Santa Clara Convention Center
Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, United States
All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries signup to be a 2026 SPONSOR / Exhibitor REGISTER HERE
Hyatt Regency San Francisco Airport
1333 Bayshore Highway, Burlingame, CA, United States
Formatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
