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ICM – International Congress Center Messe München
Messe München GmbH, Messegelände, München, Germany
Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart systems. Learn how these technologies are driving Europe’s leadership in the sensor revolution while shaping a more intelligent, interconnected future. Join us in to Sensing …
From Theory to Practice: Applying Timing Constraints Workshop Do you struggle to identify which constraints are needed for a design or how to properly input them? This workshop will cover how to use features in Vivado, clock domain crossing strategies, and how to get the most out of static timing analysis for Versal devices. This …
Discover the 5 Critical Connectivity Market Trends Reshaping Semiconductors in 2026 5G, ambient computing, and RF innovation—what’s next for connectivity semiconductors. The connectivity semiconductor industry is evolving rapidly as 5G …
About ICCAD-Expo In the development of China's integrated circuit design industry, the China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has consistently played a vital role in promoting industrial clustering, connecting industry resources, and identifying industry trends. Since its inception in 1994, ICCAD-Expo has been successfully held for 30 sessions in Shenzhen, Hangzhou, Chengdu, Wuhan, Shanghai, Zhuhai, Dalian, …
This webinar provides an in-depth discussion about the challenges posed by AI's increasing power requirements to voltage regulation, more specifically physical limitations such as power distribution losses, thermal and cooling limitations, and power density issues. It then explores innovative technologies designed to address these challenges, for example chip-embedded modules, thermally efficient inductors, and novel power …
November 20, 2025 - 11:00 AM EST November 21, 2025 – 10:00 AM JST/KST Discover the 5 Critical Automotive Market Trends Reshaping Semiconductors in 2026 AI, vehicle architectures, and trade impacts—what’s next for automotive semiconductors. The automotive semiconductor industry is navigating a complex landscape of trade tensions, evolving architectures, and AI deployment. Supply chain uncertainties …
Signia by Hilton San Jose
170 S Market St, San Jose, CA, United States
Date: Nov. 20, 2025 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose 170 S Market St San Jose, Calif.95113 PRIORITY SPONSORSHIP PERIOD NOW OPEN! The 2025 SIA Awards Dinner Priority Sponsorship Period is now open! Only Gold …
Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event; it’s a dynamic hub where the brightest minds converge to ignite the next wave of innovation. As the AI …
Description Clock domain crossings (CDCs) are a critical aspect of FPGA and embedded system design, and handling them correctly is essential for reliable operation. In this one-hour webinar, we’ll break down CDC fundamentals, explore best practices for managing single-bit and bus CDCs, and demonstrate how to leverage Xilinx Parameterized Macros (XPM) for seamless synchronization. Join …
Speaker: Hong-Cheang Quek, AE Director 10:00am~11:00am iPegasus Verification System for Virtuoso Studio 11:00am~11:15am Q&A Description: Today's complex SoC designs significantly increase layout creation and verification time, especially at advanced nodes. To meet overall demand for faster design cycle turnaround time, bridge a demand gap, and improve productivity between custom implementation and physical verification tools, Cadence …
December 2, 2025 - 11:00 AM EST December 3, 2025 – 10:00 AM JST/KST Discover the 5 Critical Advanced Packaging Market Trends Reshaping Semiconductors in 2026 AI, 3D stacking, and next-gen substrates—what’s next for advanced packaging. The advanced packaging industry is at the forefront of semiconductor innovation, driven by the explosive growth of AI and …
Santa Clara Marriott
Santa Clara, CA, United States
The semiconductor industry is experiencing accelerated innovation; demand has never been higher, complexity never greater, and the opportunities never more exciting. But realizing this potential requires partnerships, shared secure scalable solutions, and a collective commitment to pushing boundaries. In this two-day conference, you'll: Hear from visionaries at Qualcomm, Intel, GlobalFoundries, STMicroelectronics, and SAP and many others. We will demo breakthrough technologies in AI-driven …