Join us for CICC 2026, the world's premier conference devoted to IC development. April 19 – 22, 2026 Seattle, WA, USA April 22 - 23, 2026 - CHISIC Workshop About CICC The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, …
Continue reading "2026 IEEE Custom Integrated Circuits Conference (CICC)"
Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test Call for Papers The DATE conference is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test, and manufacturing of electronic circuits and systems. …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
Continue reading "Semiconductor Reliability and Product Qualification"
As AI workloads scale into the thousands of accelerators and hundreds of terabytes of distributed memory, traditional interconnects cannot deliver the deterministic latency, bandwidth efficiency, or memory semantic operations required for modern training clusters. UALink provides a purpose built accelerator fabric leveraging 224G SerDes, fixed 64 byte flits, compressed transaction formats, and high efficiency TL/DLL …
Continue reading "Webinar: Understanding UALink Architecture: A Protocol Deep Dive"
Ensure fabrication success with proven HDI design techniques and real-world tools. Overview: As AI accelerators and edge compute modules push PCB densities to their physical limits, HDI design has become the defining skill separating production-ready boards from layouts that fail at fabrication. This webinar walks through the complete HDI workflow inside Allegro X using a …
Continue reading "Webinar: HDI Design Workflow: From Decisions to Fabrication"
Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
Continue reading "TSMC 2026 North America Technology Symposium"
The 2026 MRS Spring Meeting & Exhibit, taking place April 26–May 1 in Honolulu, Hawai‘i, will convene materials researchers from academia, industry, government and national laboratories together for a week of cross-disciplinary collaboration and scientific exchange. Set against the backdrop of one of MRS’s most inspiring locations, the Meeting & Exhibit will feature breakthroughs in areas …
Join us for the User2User North America event, which is a dedicated environment for exchanging ideas, information and best practices that enable you to lead in your role and achieve success with your customers. Become a Speaker About User2User User2User is your opportunity to learn, grow and connect with fellow technical experts who design leading-edge …
In this webinar, Marvell will present how its team accelerates passive interposer routing for advanced 2.5D/3.5D multi die designs by bringing early, physics based signal integrity feedback into each routing iteration. Rather than relying on repeated, compute intensive 3D FEM cycles during development, Marvell uses a Method of Moments (MoM) early SI check available within …
FOCUSED ON SMART MANUFACTURING & SMART MOBILITY DRIVING SEMICONDUCTOR BUSINESS IN THE MIDWEST Thank you for being part of the launch of SEMIEXPO Heartland—where Smart Manufacturing and Smart Mobility came together like never before! This groundbreaking event opened new opportunities for collaboration and growth, driving us toward the semiconductor industry’s $1T future. With so much innovation …
Physical AI is increasingly popular in applications requiring real-time decision making and autonomous operation. Different from NPUs for cloud platforms, Physical AI processors can be made application-specific. By jointly tuning their ISA and memory architecture to the network models required by the application, power consumption and silicon area are drastically reduced. Synopsys ASIP Designer is …
Continue reading "Webinar: Application-Specific Processors (ASIPs) for Physical AI"
As semiconductors continue to scale, designers are turning to 3DIC architectures to meet increasing demands for performance, energy efficiency, and functional density in data centers and edge AI applications. However, stacking multiple dies introduces new multiphysics challenges including electrical, structural, and thermal issues. Join this webinar to learn how RedHawk-SC Electrothermal enables designers to analyze …
Continue reading "Webinar: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal"
