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New York University Tandon School of Engineering
New York University Tandon School of Engineering, 6 MetroTech Center, Brooklyn, NY, United States
What is the Brooklyn 6G Summit The Brooklyn 6G Summit (B6GS) is a premier event for the global communications industry, bringing together leading voices from technology, business, academia and regulation to shape the future of wireless. Jointly organized by Nokia and the NYU WIRELESS research center at the NYU Tandon School of Engineering, the Summit …
Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25, Building 17/3, Berlin, Germany
On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration …
