Join us for Demo Day – Signal Generators and discover how to accelerate and optimize RF testing with the capabilities offered by these instruments in our test bench. Learn how to perform power amplifier matching correction with a signal generator's integrated reflectometer in minutes… not hours. No additional test equipment required. We will also demonstrate how the …
Intro The Compact-Q DEER Spectrometer is designed to support researchers in academia and industry to efficiently characterize quantum materials, develop devices for quantum sensing, advance and validate algorithms to control qubits, and other applications in spin-based quantum technologies. The Compact-Q DEER system features a modern microwave architecture, high-resolution AWG, and digital signal processing schemes enabling …
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Date: Feburary 11-13, 2026 Hours February 11, 2026 | 10:00-17:00 (Last entry 16:30) February 12, 2026 | 10:00-17:00 (Last entry 16:30) February 13, 2026 | 10:00-16:00 (Last entry 15:30) Venue COEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom) Westin Seoul Parnas Grand InterContinental Seoul Parnas Scale 550 Exhibitors, 2411 booths …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. What’s New Download the ISSCC 2026 …
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All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries signup to be a 2026 SPONSOR / Exhibitor REGISTER HERE
Aerospace, defense, and other mission-critical technologies face rapidly evolving hardware threats. A hobbyist can add a single board computer to a consumer device. A nation-state can scale an exploit across critical infrastructure. The attack surface widens fast, and the security implications are real. Adversaries are continuously developing techniques that can compromise mission-critical components, sometimes before …
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Formatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
From materials to metrology: pushing the limits of lithography Share your research, challenges, and breakthroughs at this leading semiconductor conference in San Jose Submit your abstract and connect with leading researchers advancing solutions in optical lithography, EUVL, patterning technologies, metrology, and process integration for semiconductor manufacturing and related applications. Call for papers is now open. …
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FSI presents the 4th annual Florida Semiconductor Summit in 2026. Join industry leaders, innovators, and exhibitioners as we explore groundbreaking developments and the evolving future of semiconductor manufacturing in Florida. You’re invited to the 2026 Florida Semiconductor Summit! From February 23rd – 25th, 2026, the Florida Semiconductor Institute is hosting the fourth annual Florida Semiconductor Summit at …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
FLEX 2026 | TECHNOLOGY SUMMIT | FEBRUARY 24-26, 2026 THE WIGWAM ARIZONA RESORT | PHOENIX, AZ A 25th Anniversary Celebration Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ. FLEX—Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge …
The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. The Conference – A Systematic Approach to Learning & Discovery Attend the expertly curated 15-track conference created by engineers …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
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DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is the usage of specialized design and verification languages such as SystemVerilog, Verilog, VHDL, PSS, SystemC and e, as well as general purpose languages such as …
Making way for The IQ Era Much can happen in a year within our ecosystem of innovation and connectivity. As we build on the success of MWC25 and engage with MWC26 to activate a new theme – The IQ Era – the world is already shifting to greater heights of digital awareness. In this new age of intelligence, the way to a better future is through smarter connection: human …
The 22nd Annual Device Packaging Conference (DPC 2026) will be held in Phoenix, Arizona, on March 2-5, 2026. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading …
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About As global connectivity demands surge, network infrastructure hardware is under unprecedented pressure to deliver higher performance, lower latency, and greater energy efficiency, while remaining cost-effective and reliable. This challenge is compounded with the explosive growth of AI applications, emerging 5G and 6G architectures, virtualization and open interfaces, adding further strain on legacy systems and …
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