DesignCon 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. The Conference – A Systematic Approach to Learning & Discovery Attend the expertly curated 14-track conference created by engineers …

DVClub Europe: Edinburgh

Edinburgh Futures Institute, The University of Edinburgh 1 Lauriston Pl, Edinburgh

Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will be held at the Futures Institute at the University of Edinburgh and the university students will be attending. The first half of the DVClub will …

Leti Photonics Workshop 2025

San Francisco Museum of Modern Art 151 3rd Street, San Francisco, CA, United States

Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …

Semiconductor Technology Overview

Phoenix, AZ Phoenix, AZ, United States

Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …

IC Packaging Technology

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …

Advanced CMOS/FinFET Fabrication

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …

SEMICON Korea

PLATZ, COEX 513 Yeongdong-daero, Seoul, Gangnam-gu, Korea, Republic of

Beginning with 189 booths in 1987, SEMICON Korea has established itself as an exhibition representing the semiconductor industry thanks to the continuous growth of the Korean semiconductor industry. SEMICON Korea 2025 …

DVCON 2025 US

DoubleTree by Hilton Hotel San Jose 2050 Gateway Pl, San Jose, CA, United States

DVCON U.S. 2025 The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies and standards for the design and verification of electronic …

PDAC 2025

Metro Toronto Convention Centre Bremner Blvd 222, Toronto, Ontario, Canada

The World’s Premier Mineral Exploration & Mining Convention. The annual award winning PDAC Convention in Toronto, Canada brings together up to 30,000 attendees from over 130 countries for its educational …

SNUG Silicon Valley 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2025 will once again provide a place where users and technical experts …