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Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. Event Details …
AI data center networks now operate at a scale where device-level validation no longer reflects real performance. Engineers must understand how systems behave under realistic traffic conditions, not just in isolated tests. Join Ram Periakaruppan, vice president and general manager of network applications and security at Keysight, to learn how large-scale traffic emulation reveals congestion, …
About ECTC The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. REGISTER HERE
Santa Clara Marriott
Santa Clara, CA, United States
Learn from leading hardware security researchers & professionals and discuss the latest & most innovative research on attacking and defending hardware. Connect with industry peers. Join us for a bigger, bolder, and better hardwear.io. ARE YOU READY FOR HARDWEAR.IO USA 2026? In the past couple of months our goal was to knuckle down and build …
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
*Company Email Required for Registration* Full-chip SoC debug has become one of the most expensive bottlenecks in modern verification. A single production issue can pull multiple engineers away days as they chase a failure through waveforms, logs, and across hundreds of thousands of lines of code. In this webinar, we will demonstrate how the Bronco …
As semiconductor complexity increases and board designs become denser, manufacturing teams face tighter tolerances, reduced test access, and rising pressure to maintain yield and throughput. Validating RF performance and high-speed digital signal integrity at production scale adds a new layer of complexity that traditional approaches struggle to address. Join Jason Kary, Senior Vice President and …
Huntington Place Convention Center
Huntington Place Convention Center, 1 Washington Boulevard, Detroit, MI, United States
Join us in 2026 We are ready to deliver more 3,000+ attendees. Join our community of users, industry experts and trusted partners. Realize LIVE offers something for everyone! 450+ sessions. Explore breakout sessions, technical tracks, trainings and more. More than 60% of sessions were led by customers, sharing real-world insights. 90% overall satisfaction rate. Realize LIVE …
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Taipei Nangang Exhibition Center
Taipei Nangang Exhibition Center, No. 1, Jingmao 2nd Rd, Taipei City, Nangang District, Taiwan
Main Themes COMPUTEX is a leading global exhibition focused on AIoT and startups. The expo will continue with the position of “AI Next”, featuring the latest tech trends: AI & Robotics, Next-Gen Tech, and Future Mobility. Recognized for its adaptability to industry changes. It has established itself as a premier platform for showcasing technological innovations. …
Omni La Costa Resort & Spa
2100 Costa Del Mar Rd, Carlsbad, CA, United States
The Semiconductor Wafer Test Conference (SWTest) is celebrating its 35th year as the only industry event that focuses on all the aspects associated with microelectronic wafer and die level testing. The conference has the perfect mixture of manufacturer and vendor presentations. It is a probe technology forum where attendees come to learn about recent developments …
Cadence Design Systems
Cadence Design Systems, 2655 Seely Avenue, San Jose, CA, United States
“How Will Agentic AI Change Chip Design and Verification?” features EDA and emerging agentic AI company executives and entrepreneurs discussing changes within chip design and verification as agentic AI tools become more mainstream. Panelists will distill the excitement surrounding the innovation in chip design and verification, collaboration between traditional EDA and agentic AI startups and …
