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WEBINAR – Advanced Semiconductor Packaging: Leading Patent Owners and New Entrants
WEBINAR – Advanced Semiconductor Packaging: Leading Patent Owners and New Entrants
Since 2016, KnowMade has been researching and monitoring the intellectual property (IP) landscape related to advanced semiconductor packaging, including fan-out WLP, 2.5D packaging, and 3D SoC. Propelled by high-performance computing and emerging applications, a tremendous number of inventions have been published in recent years. While historical players have expanded their patent portfolios, new entrants have …