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New York University Tandon School of Engineering
New York University Tandon School of Engineering, 6 MetroTech Center, Brooklyn
What is the Brooklyn 6G Summit The Brooklyn 6G Summit (B6GS) is a premier event for the global communications industry, bringing together leading voices from technology, business, academia and regulation to shape the future of wireless. Jointly organized by Nokia and the NYU WIRELESS research center at the NYU Tandon School of Engineering, the Summit …
Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25, Building 17/3, Berlin
On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration …
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing, to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in …
