All Day

Electronic Packaging Days 2025

Fraunhofer Institute for Reliability and Microintegration IZM Gustav-Meyer-Allee 25, Building 17/3, Berlin

On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration …

SEMIEXPO Vietnam 2025

Hanoi, Vietnam Hanoi

As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing, to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in …