Failure and Yield Analysis – San Jose

Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of disciplines in order to effectively perform failure analysis. This requires knowledge of subjects like: design, testing, technology, processing, materials science, chemistry, and even optics! Failed devices and low yields can lead to customer returns and idle manufacturing lines that can cost a company millions of dollars a day. Your industry needs competent analysts to help solve these problems. Failure and Yield Analysis is a 4-day course that offers detailed instruction on a variety of effective tools, as well as the overall process flow for locating and characterizing the defect responsible for the failure. This course is designed for every manager, engineer, and technician working in the semiconductor field, using semiconductor components or supplying tools to the industry.

By focusing on a Do It Right the First Time approach to the analysis, participants will learn the appropriate methodology to successfully locate defects, characterize them, and determine the root cause of failure.

What Will I Learn By Taking This Class?

Participants will learn to develop the skills to determine what tools and techniques should be applied, and when they should be applied. This skill-building series is divided into three segments:

1. The Process of Failure and Yield Analysis. Participants will learn to recognize correct philosophical principles that lead to a successful analysis. This includes concepts like destructive vs. non-destructive techniques, fast techniques vs. brute force techniques, and correct verification.
2. The Tools and Techniques. Participants will learn the strengths and weaknesses of a variety of tools used for analysis, including electrical testing techniques, package analysis tools, light emission, electron beam tools, optical beam tools, decapping and sample preparation, and surface science tools.
3. Case Histories. Participants will identify how to use their knowledge through the case histories. They will learn to identify key pieces of information that allow them to determine the possible cause of failure and how to proceed.

Course Objectives

1. This course will provide participants with an in-depth understanding of the tools, techniques and processes used in failure and yield analysis.
2. Participants will be able to determine how to proceed with a submitted request for analysis, ensuring that the analysis is done with the greatest probability of success.
3. This course will identify the advantages and disadvantages of a wide variety of tools and techniques that are used for failure and yield analysis.
4. This course will offer a wide variety of video demonstrations of analysis techniques, so the analyst can get an understanding of the types of results they might expect to see with their equipment.
5. Participants will be able to identify basic technology features on semiconductor devices.
6. Participants will be able to identify a variety of different failure mechanisms and how they manifest themselves.
7. Participants will be able to identify appropriate tools to purchase when starting or expanding a laboratory.

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