Loading Events

« All Events

2025 TSMC Open Innovation Platform Ecosystem Forum – Taiwan

November 18
Screenshot 2025 08 20 145418

Join us for the 2025 TSMC OIP ECOSYSTEM FORUM

Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event; it’s a dynamic hub where the brightest minds converge to ignite the next wave of innovation.

As the AI revolution proliferates from the data center to the edge and becomes integrated into every application, the need for high-performance and energy-efficient designs is becoming paramount. Through a series of compelling, multi-track presentations, you’ll gain a firsthand understanding of how the ecosystem is collaboratively tackling these critical design requirements.

AI is also transforming how chip and multi-die designs are done. This year, the forum will highlight how the ecosystem is harnessing the immense potential of AI in next generation of design solutions for TSMC’s advanced process and packaging technologies. Prepare to be immersed in a wealth of knowledge as industry trailblazers and TSMC’s ecosystem partners offer valuable insights into the latest breakthroughs.

The event provides a unique opportunity for you to engage with thought leaders and innovators, whether you join in-person at locations across North America, Japan, Taiwan, China, and Europe, or participate online.

Don’t miss this opportunity to connect with the leading players of semiconductor technology and be part of shaping tomorrow’s innovations, today!

Opportunity to gain insights into

  • Solutions needed to address energy efficiency and other challenges impacting the next-generation AI chips and corresponding design flows and methodologies for TSMC A16™, N2, and N3 processes
  • Consistent progress in design enablement and solution development for TSMC’s advanced processes including A14, TSMC A16™ and N2
  • Latest advancements in design solutions on TSMC 3DFabric® chip stacking (including InFO, CoWoS®, TSMC-SoIC®, TSMC-SoW™), as well as updates on the TSMC 3DFabric Alliance
  • AI-assisted design flows for 2D and 3DIC design productivity and optimization
  • Design enablement technologies, IPs, and solutions targeting the latest HPC, AI/ML, automotive, mobile/5G and IoT applications
  • Comprehensive design solutions for specialty technologies including ultra-low power, ultra-low voltage, analog migration, RF, and mmWave
  • Successful, real-life applications of design technologies, IP solutions, and cloud-based designs from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market

REGISTER HERE

Share this post via:

Venue

Sheraton Hsinchu Hotel
Sheraton Hsinchu Hotel, No. 265號, E Section 1, Guangming 6th Rd
Zhubei City, Hsinchu County 302 Taiwan
+ Google Map