WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 752
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 752
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)
            
Q2FY24TessentAI 800X100
WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 752
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 752
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)

How to Find and Fix Soft Reset Metastability

How to Find and Fix Soft Reset Metastability
by Mike Gianfagna on 05-20-2024 at 6:00 am

How to Find and Fix Soft Reset Metastability

Most of us are familiar with the metastability problems that can be caused by clock domain crossings (CDC). Early static analysis techniques can flag these kinds of issues to ensure there are no surprises later. I spent quite a bit of time at Atrenta, the SpyGlass company, so I am very familiar with these challenges. Due to the demands… Read More


Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification

Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification
by Mike Gianfagna on 05-13-2024 at 6:00 am

Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification

2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More


Rigid-flex PCB Design Challenges

Rigid-flex PCB Design Challenges
by Daniel Payne on 05-07-2024 at 10:00 am

PADS Professional Design

From Zion Research I learned that the flexible electronics market was about $13.2B in 2021 and growing at a CAGR of 21%, so that was impressive. There are several factors that make rigid-flex circuit so attractive, like: space efficiency, reduced weight, enhanced reliability, improved signal integrity, streamlined assembly,… Read More


Will my High-Speed Serial Link Work?

Will my High-Speed Serial Link Work?
by Daniel Payne on 04-30-2024 at 10:00 am

traditional flow min

PCB designers can perform pre-route simulations, follow layout and routing rules, hope for the best from their prototype fab, and yet design errors cause respins which delays the project schedule. Just because post-route analysis is time consuming doesn’t mean that it should be avoided. Serial links are found in many PCB designs,… Read More


Enabling Imagination: Siemens’ Integrated Approach to System Design

Enabling Imagination: Siemens’ Integrated Approach to System Design
by Kalar Rajendiran on 04-30-2024 at 6:00 am

Siemens EDA Important to Siemens

In today’s rapidly advancing technological landscape, semiconductors are at the heart of innovation across diverse industries such as automotive, healthcare, telecommunications, and consumer electronics. As a leader in technology and engineering, Siemens plays a pivotal role in empowering the next generation … Read More


Design Stage Verification Gives a Boost for IP Designers

Design Stage Verification Gives a Boost for IP Designers
by Mike Gianfagna on 04-25-2024 at 6:00 am

Design Stage Verification Gives a Boost for IP Designers

The concept of shift left is getting to be quite well-known. The strategy involves integrating various checks typically performed later in the design process into earlier stages. The main benefit is to catch and correct defects or errors at an earlier stage when it’s easier and faster to address. For complex SoC design, … Read More


Checking and Fixing Antenna Effects in IC Layouts

Checking and Fixing Antenna Effects in IC Layouts
by Daniel Payne on 03-14-2024 at 10:00 am

Planar CMOS cross-section – antenna DRC

IC layouts go through extensive design rule checking to ensure correctness, before being accepted for fabrication at a foundry or IDM. There’s something called the antenna effect that happens during chip manufacturing where plasma-induced damage (PID) can lower the reliability of MOSFET devices. Layout designers run Design… Read More


Siemens Promotes Digital Threads for Electronic Systems Design

Siemens Promotes Digital Threads for Electronic Systems Design
by Bernard Murphy on 03-06-2024 at 6:00 am

Digital threads min

Many years ago, I remember discussions around islands of automation/silos. Within the scope of any given silo there is plenty of automation to handle tasks relevant to that phase. But managing the full lifecycle from concept through manufacturing to field support must cross between silos, and those transitions are not as clean… Read More


Designing for Security for Fully Autonomous Vehicles

Designing for Security for Fully Autonomous Vehicles
by Kalar Rajendiran on 03-05-2024 at 10:00 am

OSI Seven layer model for securing network communication

With the advent of IoT devices, vehicles have become increasingly interconnected, offering enhanced automation, connectivity, electrification, and shared mobility. However, this progress also brings forth unprecedented challenges, particularly in ensuring the safety and security of automotive electronics. The complexity… Read More


INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with advanced analog and mixed-signal EDA technology

INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with advanced analog and mixed-signal EDA technology
by Daniel Nenni on 03-05-2024 at 6:00 am

siemens symphony interchip large

Customer case studies have always been my favorite source of information. Press releases are a great start but there is always more to the story. Fortunately, I had the opportunity to speak with Sumit Vishwakarma, principal product manager at Siemens EDA about their recent press release with Interchip. I was an advisor to Berkeley… Read More