Jr. APE Engineer

Website Alchip
Description
1. Advanced Chiplet and 2.5d IC CoWoS packaging technology development.
2. Flip chip, Bumping, Fan-Out package technology development.
3. New product introduction development (NTO, DOE and corner plan, yield analysis, MP window)
Requirements
1. +1 years of experience in Semiconductor Manufacturing specialized in advanced package engineering.
2. Good experience in 2.5d IC CoWoS, Fan-Out, Flip chip, Bumping wafer level packaging.
3. Good communication skills and fluency in both verbal and written English.
4. Experience working with diverse cultures.
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