TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and Ecosystems

TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and Ecosystems
by Mike Gianfagna on 09-30-2026 at 12:00 pm

TSMC OIP Ecosystem Forum 2026 Broadcom’s View of ASICs and Ecosystems

I spent a significant part of my career in the ASIC business. This segment of semiconductors has always been challenging, difficult and invigorating. There is something special about delivering a working custom chip that enables your customer to bring a world-changing product to market. It has always been a highly competitive… Read More


The Future of CPO May Be a Glass Integration Platform

The Future of CPO May Be a Glass Integration Platform
by Moh Kolb on 09-21-2026 at 8:00 am

CPO on a glass patfrom

Co-packaged optics is usually described as a proximity problem.

Move the optical engine closer to the switch ASIC or XPU. Shorten the electrical path. Reduce SerDes power. Increase bandwidth density.

That direction is real.

Optical functionality is moving progressively closer to compute.

But proximity does not eliminate … Read More


Broadcom’s AI Engine Shifts Into Overdrive

Broadcom’s AI Engine Shifts Into Overdrive
by Daniel Nenni on 09-20-2026 at 8:00 am

The XPU Effect Broadcom AI

Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More