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Advanced Packaging Analysis at DesignConby Tom Dillinger on 06-07-2022 at 10:00 amCategories: EDA, Xpeedic
The slogan for the DesignCon conference has been “where the chip meets the board”. Traditionally, the conference has provided a breadth of technical presentations covering the design and analysis of high-speed communication interfaces and power integrity evaluations between chip, board, and system.
The recent DesignCon… Read More
