Cu-Pillar in Advanced Logic Devices

Cu-Pillar in Advanced Logic Devices
by Arabinda Das on 04-10-2015 at 7:00 pm

In 2001, flipchip with solder bump was already a dominant technology and it was replacing wire bonding as the main interconnection choice for a growing number of devices. It was offering fine pitch interconnections for increased I/O counts. In the solder bump process, a bump is formed on the chip and on the package substrate and … Read More