The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More
Tag: TDK
CEO Interview: BRAM DE MUER of ICsense
Bram co-founded ICsense in 2004 as a spin-off of the University of Leuven. He is CEO since 2004 and helped growing the company from 4 to over 100 people in 20 years while being profitable every year. He managed the acquisition by TDK in 2017. He is an experienced entrepreneur in the micro-electronics field with a strong interest in … Read More