Learn more about the new features in Ansys Sherlock 2024 R1, including PySherlock for scripting and automation, Sherlock’s integration with Workbench, and the availability of Linux, allowing users to choose the operating system best suited to their needs.
TIME:
MARCH 14, 2024
11 AM EDT / 4 PM CET / 8:30 PM IST
Venue:
Virtual
Discover how the Sherlock-Workbench integration simplifies, accelerates, and expands mechanical, thermal, and reliability simulations of electronic systems in this upcoming webinar.
TIME:
APRIL 4, 2024
11 AM EDT / 5 PM CEST / 8:30 PM IST
Venue:
Virtual
In this webinar, you will learn how the Sherlock-Workbench integration
Rand Simulation’s FEA (Structural) Consulting Engineer, Adam LeMay, will be presenting an introduction to Ansys Sherlock for electronics reliability for enhanced product designs via virtual testing (simulation).
During this webinar, you’ll learn about:
– The environmental challenges that printed… Read More
As electronics become more pervasive across numerous industries, understanding reliability and failure risks becomes increasingly important. Attend our 2023 R2 webinar to learn about the latest software updates for electronics reliability simulation and analysis.
TIME:
SEPTEMBER 7, 2023
11 AM EST
Venue:
Virtual
Learn about the latest updates to the Electronics Reliability product portfolio, including more advanced integrations between Mechanical, LS-DYNA, Sherlock & Icepak.
TIME:
MARCH 1, 2023
11 AM EST
Ansys 2023 R1 introduces significant advances across the Ansys suite of tools supporting Electronics
Time:
August 24, 2021
1 PM EDT / 6 PM BST / 10:30 PM IST
Venue:
Online
About this Webinar
This webinar spotlights major updates to Ansys Electronics Reliability solutions in 2021 R2. Ansys Electronics Reliability solutions feature comprehensive workflows involving Ansys Sherlock, Ansys Mechanical, Ansys Icepak,
March 24, 2020
12:00 PM – 1:00 PM (EDT)
Venue: Online
Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical… Read More
