ANSYS Icepak and Sherlock For Temperature Cycling

ANSYS Icepak and Sherlock For Temperature Cycling
by Admin on 03-24-2020 at 12:00 pm

March 24, 2020

12:00 PM – 1:00 PM (EDT)

Venue: Online

Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical… Read More