Ansys 2023 R1: Ansys Sherlock and Electronics Reliability What’s New

Ansys 2023 R1: Ansys Sherlock and Electronics Reliability What’s New
by Admin on 01-11-2023 at 3:50 pm

Learn about the latest updates to the Electronics Reliability product portfolio, including more advanced integrations between Mechanical, LS-DYNA, Sherlock & Icepak.

TIME:
MARCH 1, 2023
11 AM EST

About This Webinar

Ansys 2023 R1 introduces significant advances across the Ansys suite of tools supporting Electronics

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Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update

Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update
by Admin on 08-11-2021 at 8:07 am

Time:
August 24, 2021
1 PM EDT / 6 PM BST / 10:30 PM IST

Venue:
Online

About this Webinar

This webinar spotlights major updates to Ansys Electronics Reliability solutions in 2021 R2. Ansys Electronics Reliability solutions feature comprehensive workflows involving Ansys Sherlock, Ansys Mechanical, Ansys Icepak,

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ANSYS Icepak and Sherlock For Temperature Cycling

ANSYS Icepak and Sherlock For Temperature Cycling
by Admin on 01-07-2020 at 2:20 pm

March 24, 2020

12:00 PM – 1:00 PM (EDT)

Venue: Online

Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical… Read More