The Package Assembly Design Kit (PADK)… the start of something big

The Package Assembly Design Kit (PADK)… the start of something big
by Tom Dillinger on 08-19-2016 at 12:00 pm

Integrated wafer-level fanout (WLFO) packaging technology is emerging as a foundation for multi-die solutions. Mobile product applications require focus on both aggressive chip-to-chip interface performance, as well as the final package volume. Traditional multi-chip packages using PCB laminate substrates do not readily… Read More