Cadence TechTalk: Design Robust IC Packages Faster Using In-Design SI/PI Analysis

Cadence TechTalk: Design Robust IC Packages Faster Using In-Design SI/PI Analysis
by Admin on 04-17-2023 at 3:30 pm

IC package design teams and characterization teams have had a “throw-it-over-the-wall” relationship for decades, which often delays design releases by months. However, as signal integrity (SI) and power integrity (PI) challenges evolve with multi-die heterogeneous integration, the need to perform SI/PI analysis as part

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