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Load-pull power amplifier (PA) design techniques determine the optimal impedances at the power transistor’s extrinsic reference plane, which is the physically accessible boundary for measurement or simulation. This reference plane can be the package transistor leads, die bond pads, or IC chip terminals. It includes… Read More
At lower frequencies with simpler modulation, RF power amplifier (PA) designers could safely concentrate on a few primary metrics – like gain and bandwidth – and rely on relaxed margins to ensure proper operation in a range of conditions. Today’s advanced RF PA design is a different story. mmWave and sub-THz frequencies introduce… Read More
