Semiconductor designers today face a critical hurdle: how to smoothly transition from an open-source hardware blueprint to a commercially hardened, production-ready silicon implementation. As semiconductors play an increasingly essential role in powering the AI era, safeguarding these hardware foundations has become… Read More
Cadence hosted its annual CadenceLIVE Americas conference June 8th-June 9th. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.
The C-suite keynotes were delivered by Lip-Bu Tan (CEO) and Dr. Anirudh Devgan (President). The talks… Read More
3D-IC has a stack of dies connected and packaged together, and therefore needs new testing strategies other than testing a single die. It’s given that a single defective die can render the whole of 3D-IC unusable, so each die in the stack must be completely and perfectly tested before its entry into that stack. Looking at it from a … Read More
