System Planning and Implementation for Different 3D-IC Design Styles

System Planning and Implementation for Different 3D-IC Design Styles
by Admin on 03-09-2022 at 12:00 am

March 9, 2022

Overview

System planning is a major part of the multi-chiplet design. Whether it’s a 2.5-D configuration with an interposer or full-stacked 3D design mounted on a package, it is important to have an automated way to do bump assignment and optimization along with 3D structures implementation. With methodology evolving

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When FPGA Design Looks More Like ASIC Design

When FPGA Design Looks More Like ASIC Design
by Bernard Murphy on 06-08-2018 at 7:00 am

I am sure there are many FPGA designers who are quite content to rely on hardware vendor tools to define, check, implement and burn their FPGAs, and who prefer to test in-system to validate functionality. But that approach is unlikely to work when you’re building on the big SoC platforms – Zynq, Arria and even the big non-SoC devices.… Read More