In February of 2026, Taiwan Semiconductor Manufacturing Company (TSMC) will host the TSMC AZ Exclusive Experience Day in Phoenix, Arizona, offering selected participants a rare opportunity to engage directly with one of the most advanced semiconductor manufacturing organizations in the world. The event will serve as an immersive… Read More
Device Packaging Conference 2027
ADVANCED PACKAGING FOR SCALABLE AI: CONNECTING COMPUTE, MEMORY, POWER AND PHOTONICS
Sheraton Grand at Wild Horse Pass
Phoenix, Arizona
March 1-4, 2027
The 23rd Annual IMAPS Device Packaging Conference (DPC 2027) will be held in Phoenix, Arizona, on March 1-4, 2027. It is an international event organized by the International… Read More