The 22nd Annual Device Packaging Conference (DPC 2026) will be held in Phoenix, Arizona, on March 2-5, 2026. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social… Read More
A 25th Anniversary Celebration
Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ.
FLEX—Technology Summit is a vibrant networking event designed to foster community building. … Read More
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate… Read More
