3D ICs, the state of the union

3D ICs, the state of the union
by Paul McLellan on 01-14-2011 at 7:30 am

I attended the 3D architectures for semiconductor integration and packaging conference just before Christmas. I learned a lot and have put together an overview of what is going on in 3D ICs. This is not intended for experts (and if I’ve made egregious errors then please correct them in the forum) but more for people who are … Read More