As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
On November 10th I watched the presentation by L.C. Lu, TSMC Fellow & VP, as he talked about enabling system innovation with dozens of slides in just 26 minutes. TSMC is the number one semiconductor foundry in the world, and their Open Innovation Platform (OIP) events are popular and well attended as the process technology and… Read More
Throughout its history, the ASIC industry has had its ups and downs. With feast and famine cycles, the ASIC business model is not for the faint of heart. Some companies tread boldly while others dread the cycles and stay away from this business model. Those who are consistently successful have to overcome many challenges thrown … Read More
