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The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More
The evolution of low-cost heterogeneous multi-chip packaging (MCP) has led to significant system-level product innovations. Three classes of MCP offerings have emerged:
- wafer-level fan-out redistribution, using reconstituted wafer substrates of molding compound as the surface for interconnections between die (2D)
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