Podcast EP179: An Expert Panel Discussion on the Move to Chiplets
Dan is joined by a panel of experts to discuss chiplets and 2.5/3D design. The panelists are: Saif Alam – Vice President of Engineering at Movellus Inc., Tony Mastroianni Siemens EDA- Advanced Packaging Solutions Director and Craig Bishop – CTO Deca Technologies.
In this spirited and informative discussion the … Read More