The Latest in Dielectrics for Advanced Process Nodes

The Latest in Dielectrics for Advanced Process Nodes
by Tom Dillinger on 01-12-2021 at 6:00 am

new ILDs v2

Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention.  Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More


In-Design DFM Signoff for 14nm FinFET Designs

In-Design DFM Signoff for 14nm FinFET Designs
by Pawan Fangaria on 11-04-2014 at 4:00 pm

While FinFET yield controversy is going on, I see a lot being done to improve that yield by various means. One prime trend today, it must be, it’s worthwhile, is to pull up various signoffs as early as possible during the design cycle. And DFM signoff is a must with respect to yield of fabrication. This reminds me about my patents filed… Read More