3D-IC: Embedded Passives

3D-IC: Embedded Passives
by Arabinda Das on 03-02-2015 at 1:00 am

IEDM 2014 was held in the second week of December 2014 in San Francisco. The excitement is over now and the dust has settled. Last week, at my leisure, I was glancing through the conference proceedings and short course material from IEDM 2014, when a slide from the 3DIC short course caught my attention. The slide presented below gives… Read More


Intel has Another First for 14nm Production!

Intel has Another First for 14nm Production!
by Daniel Nenni on 12-10-2014 at 7:00 am

An interesting thing happened while I was researching a slide from Bill Holt’s “Advancing Moore’s Law” presentation at last month’s analyst meeting. Slide #19 mentioned that Intel was the first to use “air gap” dielectric spaces to improve performance in a digital logic flow for microprocessors. I know a certain foundry that … Read More