Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows

Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
by Admin on 05-20-2022 at 2:06 pm

Date: Thursday, June 16, 2022

Time: 11:00am – 12:00pm (PDT)

Overview

System designers face increasing challenges in meeting technical specifications and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continues to grow. Large pin counts of flipped and rotated ICs may… Read More


CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows – EMEAI

CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows – EMEAI
by Admin on 05-20-2022 at 1:40 pm

EMEAI Session

Date: Tuesday, June 14, 2022

Time: 09:00 BST / 10:00 CEST / 11:00 EEST and Israel / 13:30 IST

System designers face increasing challenges to meet technical specification and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continue to grow. Large pin counts of flipped

Read More

Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows

Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
by Admin on 05-18-2022 at 4:42 pm

Date: Tuesday, June 14, 2022

Time: 09:00 BST / 10:00 CEST / 11:00 EEST and Israel / 13:30 IST

System designers face increasing challenges to meet technical specification and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continue to grow. Large pin counts of flipped and rotated

Read More