Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows

Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
by Admin on 06-16-2022 at 12:00 am

Date: Thursday, June 16, 2022

Time: 11:00am – 12:00pm (PDT)

Overview

System designers face increasing challenges in meeting technical specifications and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continues to grow. Large pin counts of flipped and rotated ICs may… Read More


Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows

Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
by Admin on 06-14-2022 at 12:00 am

Date: Tuesday, June 14, 2022

Time: 09:00 BST / 10:00 CEST / 11:00 EEST and Israel / 13:30 IST

System designers face increasing challenges to meet technical specification and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continue to grow. Large pin counts of flipped and rotated

Read More

CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows – EMEAI

CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows – EMEAI
by Admin on 06-14-2022 at 12:00 am

EMEAI Session

Date: Tuesday, June 14, 2022

Time: 09:00 BST / 10:00 CEST / 11:00 EEST and Israel / 13:30 IST

System designers face increasing challenges to meet technical specification and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continue to grow. Large pin counts of flipped

Read More